Thick Copper Technology
| Thick Copper Technology | ||||
| Layer | 18L | 20L | 20L | |
| Maximum inner copper thickness（oz） | 6 | 6 | 8 | |
| Maximum outer copper thickness（oz） | 8 | 8 | 10 | |
| Maximum Thickness (mm) | 5 | 6.5 | 6.5 | |
| Repeatedly pressing | 2 | 4 | 6 | |
| Through hole thickness to diameter ratio | VIA 10 : 1 | VIA 12 : 1 | VIA 14 : 1 | |
| Mechanical blind hole 0.8 : 1 | Mechanical blind hole 1.0 : 1 | Mechanical blind hole 1.2 : 1 | ||
| Inner | 4oz Min line width/ spacing (mm) | 0.30/0.30 | 0.27/0.27 | 0.25/0.25 |
| 6oz Min line width/ spacing (mm) | 0.55/0.55 | 0.50/0.50 | 0.45/0.45 | |
| Outer | 4oz Min line width/ spacing (mm) | 0.30/0.30 | 0.27/0.27 | 0.25/0.25 |
| 8oz Min line width/ spacing (mm) | / | 0.65/0.65 | 0.60/0.60 | |
| Withstand Voltage | VDC（V） | 3200 | 4000 | 6000 |
