SLP Process Technology
| SLP Process Technology | ||
| Item | 2022 | 2023 |
| Core material | HL832NXA | HL832NS |
| DS-7409HGB / （S） | DS-7409 （LE） | |
| R1515E | R1515H | |
| S1643HU | SI 110U | |
| Layer, core/PP thickness（μm） | 2L, 100/40 | |
| 4L, 180/50/25 | ||
| 6L, 250/50/25 | ||
| Process | Tenting | |
| Trace width/space (mm) | 0.04/0.04 | 0.03/0.03 |
| Golden finger space (mm) | 0.1 | 0.09 |
| BGA space (mm) | 0.4 | 0.4 |
| Mechanical annular ring (mm) | 0.1/0.2 | 0.1/0.175 |
| Blind annular ring (mm) | 0.065/0.15 | 0.065/0.135 |
| Impedance（Ω） | EG23A, AUS308 | |
| SR Reg ±30 | SR Reg ±20 | |
| Flatness: 8max | ||
