Special Board Technology
| Special Board Technology | |||
| Parameter | 2021 | 2022 | 2023 |
| Special Boards | 20L | 20L | 24L |
| Max. Board Size (mm) | 520*1100 | 520*1100 | 520*1100 |
| Max. Board thickness (mm) | 4 | 5 | 6.5 |
| Min. Core Thickness (mm) | 0.075 | 0.05 | 0.05 |
| Layer Registration | ±0.125 | ±0.1 | ±0.1 |
| Min. Hole Size (mm) | 0.2 | 0.175 | 0.15 |
| Multi-Lamination | 3 times | 4 times | 6 times |
| Aspect Ratio | Through hole：10:1 Blind hole/Backdrill : 0.8:1 | Through hole：12:1 Blind hole/Backdrill : 1.0:1 | Through hole：14:1 Blind hole/Backdrill : 1.2:1 |
| Min. Line Width/Space (mm) | 0.075/0.075 | 0.064/0.064 | 0.05/0.05 |
| Min. PAD (Inner) (mm) | Hole size+0.2 | Hole Size+0.17 | Hole Size+0.15 |
| Min. PAD (Outer) (mm) | 0.2 | 0.18 | 0.15 |
| Impedance Control | ±10% | ±8% | ± 8% |
| Surface Treatment | HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, Peelable Soldermask, HASL+Goldfinger, Electroplated Gold, Electroplated Silver, ENEPIG | ||
| Materials | FR-4, Ceramic, PTFE, PTFE+FR4, Ceramic+ FR4, Metal based, BT | ||
