FPC Technology
| FPC Technology | ||||
| Item | Routine Process | Special Process | ||
| Min line width/spacing（μm） | 35/35 | 30/30 | ||
| Min hole（μm） | Laser Via Land | 75 | 50 | |
| Via Hole land | 100 | 100 | ||
| Thin finger pitch tolerance and CPK | pitch≥90 ±20 CPK≥1.67 | pitch≥80 ±15 CPK≥1.67 | ||
| pitch≥70 ±15 CPK≥1.33 | pitch≥60 ±15 CPK≥1.33 | |||
| Surface treatment（μm） | Gold Plating | Ni: 2~6 / Au: 0.03~0.5 | ||
| ENIG | Ni: 2~6 / Au: 0.03~0.1 | |||
| OSP | 0.2~0.4 | |||
| Impedance control（Ω） | 100±10% | 100±8% | ||
| Min pin spacing for surface soldering components （μm） | 35 | 30 | ||
| Min machinable RC-component | 1005 | 1005 | ||
| Min machinable connector Pitch（μm） | 30 | |||
| Min machinable BGA device Pitch（μm） | 30 | |||
| Dispensing ability（μm） | 0.8 | 0.6 | ||
| Dispensing ability-Underfill（μm） | 0.8 | 0.6 | ||
