High thermal conductivity Technology
| High thermal conductivity Technology | |
| Items | Material / Parameters |
| Material | Al Based, Al Based (Al : 3003, 5052, 6061） Copper Based, Copper Based (Cu : T1, T2, T3） Ceramic Baesed (Material : AL2O3, ALN） |
| Metal Based Material Supplier ：Chuang Hui, Wazam, Ventech, Polytronics, | |
| Ceramic Based Material Supplier ：Kyocera, Bergquist | |
| Layers | 1-6L |
| Metal Based Thermal Conductivity (W/m.k) | Conductive PP ： 2, 3, 4, 6, 8 |
| ThermalElectro Seperation ： 12, 25, 77, 380 Copper/Alu Mix ： 49-104 | |
| Ceramic Based Thermal Conductivity (W/m.k) | AL2O3： 96% Purity ---26；99% Purity ---30 |
| ALN： 99.9% Purity－－－67 | |
| Board Thickness (mm) | Metal Based ：1.0, 1.2, 1.6, 2.0, 2.3 |
| Ceramic Based ：0.83, 1.0, 1.5, 3.0 | |
| Copper Thickness (Oz) | H, 1, 2, 3 |
| Delivery Size : | Metal Based ：min:18*18 ；max:500*585 Ceramic Based ：min:2*2；max 100*100 |
