HDI Technology
| HDI Technology | |||
| Parameter | 2021 | 2022 | 2023 |
| HDI | ≤10L ELIC | ≤12 L ELIC | ≤14 L ELIC |
| Max. Board Size (mm) | 540*620 | 540*620 | 540*620 |
| Board Thickness (mm) | 0.24-3.2 | 0.22-3.2 | 0.2-3.2 |
| Min. Core Thickness (mm) | 0.05 | 0.05 | 0.05 |
| Min. Laser Hole/Pad size (mm) | 0.075/0.225 | 0.07/0.225 | 0.07/0.225 |
| Min. Mechanical Drill Hole/Pad (mm) | 0.10/0.35 | 0.10/0.35 | 0.10/0.35 |
| Min. Line width/space (mm) | 0.05/0.05 | 0.04/0.04 | 0.04/0.04 |
| BGA Pitch (mm) | 0.4 | 0.35 | 0.3 |
| Copper Thickness (oz) | 1/3 ~ 4 | 1/3 ~ 6 | 1/3 ~ 8 |
| Layer Registration | ±0.06 | ±0.06 | ±0.06 |
| Blind Via Aspect Ratio | 0.8 : 1 | 1 : 1 | 1 : 1 |
| Vias Aspect Ratio | 10 : 1 | 14 : 1 | 16 : 1 |
| Dimple (µm) | ≤10 | ≤10 | ≤10 |
| Warpage | ≤0.6% | ≤0.5% | ≤0.4% |
| Impedance Control | ±10% | ±8% | ±8% |
