Rigid-Flex Process Technology
| Rigid-Flex Process Technology | |||
| Parameters | Routine Process | Special Process | |
| Layer counts | 2-24L | 32L | |
| Max board thickness (mm) | 3.2 | 5 | |
| Min board thickness (4L) (mm) | 0.35 | 0.3 | |
| Min flex width (mm) | 2 | 1.5 | |
| Max board size (mm) | 230*480 | 700*480 | |
| Min trace width/space (mm) | Inner layer | 0.05/0.05 | 0.05/0.05 |
| Outer layer | 0.075/0.075 | 0.0625/0.0625 | |
| Registration (mm) | Registration tolerance | ±0.025 | ±0.02 |
| Hole to Line Tolerance | ±0.175 | ±0.125 | |
| Max finished copper thickness（oz） | 2 | 3 | |
| HDI type | 2+N+2 | 3+N+3 Any layer | |
| Diameter (mm) | Through Hole | ≥ 0.2 | ≥ 0.15 |
| Blind Hole | 0.1 | 0.075 | |
| Aspect ratio | Through Hole | 12 : 1 | 20 : 1 |
| Blind Hole | 0.8 : 1 | 1 : 1 | |
| Hole location tolerance | Through Hole | ±0.075 | ±0.05 |
